hpe c3000 c7000 interconnect filler module 414053 001 peak laser platinum the compact design and user-friendly

the compact design and user-friendly interface simplify installation and maintenance processes

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Choosing the D12_2 RX4 PCB means investing in a component that upholds Siemens’ commitment to quality and innovation

hpe c3000 c7000 interconnect filler module 414053 001 peak laser platinum the compact design and user-friendlyQuick Specs Type: Interconnect bay filler blank Enclosure Compatibility: HPE BladeSystem C3000 and C7000 Purpose: Maintains airflow and thermal balance Installation: Tool less, snap in design Use Case: Blocks empty interconnect bays when no module is present Material: Durable plastic construction Part Number: 414053 001 The HPE C3000 & C7000 Interconnect Filler Module is a precision designed blank used to fill empty interconnect bays in BladeSystem